Water-cooling thermal dissipating system and thermal dissipating method

ABSTRACT

A water-cooling thermal dissipating system includes an electronic device and a thermal dissipating device. The electronic device includes a computing module includes a computing unit releasing heat when operation. The thermal dissipating device includes a thermal conducting unit, a pump, a tank, a thermal exchanger, and a controlling module; the thermal conductive unit is attached to the computing unit for thermal conduction; the pump is coupled to the thermal conductive unit, the pump, the tank, and the thermal exchanger for pumping a cooling-liquid therethrough, such that the cooling liquid is allowed to flow into the thermal conductive unit for absorbing heat. The controlling module generates an abnormal signal when the thermal dissipating device is sensed to be in an abnormal state, and the computing module forces to shut down the electronic device after continually receiving the abnormal signal for a predetermined time.

CROSS REFERENCE

This application is a Continuation-in-Part of co-pending applicationSer. No. 13/845,729, filed on Mar. 18, 2013, for which priority isclaimed under 35 U.S.C. § 120; and this application claims priority ofApplication No. 101114395 filed in Taiwan on Apr. 23, 2012 under 35U.S.C. § 119; the entire contents of all of which are herebyincorporated by reference.

BACKGROUND

Technical Field

The present disclosure relates to a thermal dissipating system, and inparticular to a water-cooling thermal dissipating system and a thermaldissipating method

Description of Related Art Computer application and people's life areinseparable because the improvement of word-processing ability ofcomputer and software, and more and more students and office workerscompletely prearranged work and entertainment by computer.

The integrated circuits (ICs) disposed within the computer becomesmaller and small, however, the heat generated by the operating ICsbecome higher and higher, especially the heat generated by the centralprocessing unit (CPU) is the highest so as to increase the temperaturesaround the CPU. The high temperature environment operation will slowerthe operating speed of the ICs, and is a main reason for damaging theICs.

In order to solve the problem mentioned above, a part of manufacturersuse heat tanks, fans and water-cooling thermal dissipating system tocollectively conducted heat. However, conventional water-cooling thermaldissipating system cannot communicate with software installed in thecomputer or warn user when unusual operation or damage. Such that thewater-cooling thermal dissipating system is damaged or even blastingbecause user cannot instantaneously close a part of operated programs orenhance thermal dissipating ability of the water-cooling thermaldissipating system, and then the computer is consequentially damaged.

SUMMARY

It is an object to provide a water-cooling thermal dissipating systemincludes an electronic device and a thermal dissipating device. Theelectronic device includes a computing module, a power supply unit, anda display unit. The computing module includes a computing unit releasingheat when operation; the power supply unit is electrically connected tothe computing module and configured to supply an electricity to thecomputing module; and the display unit is electrically connected to thecomputing module. The thermal dissipating device includes a thermalconducting unit, a pump, a tank, a thermal exchanger, a controllingmodule, and a cable; the thermal conductive unit is disposedcorresponding to the computing unit and attached to an external surfaceof the thermal conductive unit for thermal conduction; the pump iscoupled to the thermal conductive unit for pumping a cooling-liquid intothe thermal conductive unit; the tank is coupled to the pump, whereinthe cooling-liquid is storage in the tank; the thermal exchanger iscoupled to the thermal conductive unit and the tank, wherein the coolingliquid is allowed to flow into the thermal conductive unit for absorbingheat produced by the computing unit, and the thermal exchanger thenthermally transfers heat within the cooling liquid to the externalenvironment for dispersing heat; the controlling module is configured tosense a working state and control heat dissipation efficiency of thethermal dissipating device; and the cable is connected to the computingmodule and the controlling module, wherein the computing module and thecontrolling module are electrically connected to each other through thecable. An abnormal signal is generated and send to the computing modulethrough the cable by the controlling module when the thermal dissipatingdevice is sensed to be in an abnormal state by the controlling module,the computing module then makes the display unit show alarm informationto inform users and forces to shut down the electronic device aftercontinually receiving the abnormal signal for a predetermined time.

It is another object to provide a thermal dissipating method for athermal dissipating device coupled to an electronic device, the thermaldissipating method includes the following steps: sensing if a thermaldissipating device is in an abnormal state; generating an abnormalsignal when the thermal dissipating device is in an abnormal state; andforcing to shut down the electronic device after continually receivingthe abnormal signal for a predetermined time.

BRIEF DESCRIPTION OF DRAWING

The present disclosure can be more fully understood by reading thefollowing detailed description of the embodiment, with reference made tothe accompanying drawings as follows:

FIG. 1 is a schematic view of a water-cooling thermal dissipating systemaccording to the present disclosure;

FIG. 2A is a circuit block diagram of the water-cooling thermaldissipating system according to a 1st embodiment of the presentdisclosure;

FIG. 2B is a circuit block diagram of water-cooling thermal dissipatingsystem according to the 2nd embodiment of the present disclosure;

FIG. 3 is a flowchart showing steps for booting an electronic deviceaccording to the present disclosure;

FIG. 4 is a flowchart showing steps for a thermal dissipating method ofthe water-cooling thermal dissipating system according to the presentdisclosure; and

FIG. 5 is a flowchart showing steps for a self-condition inspectionaccording to the present disclosure;

DETAILED DESCRIPTION

A preferred embodiment of the present disclosure will be described withreference to the drawings.

FIG. 1 is a schematic view of a water-cooling thermal dissipating systemaccording to a 1st embodiment of the present disclosure, and FIG. 2A isa circuit block diagram of the water-cooling thermal dissipating systemaccording to the 1st embodiment of the present disclosure. In FIG. 1 andFIG. 2A, the water-cooling thermal dissipating system (its referencenumeral is omitted) includes a thermal dissipating device 1 and anelectronic device 2, and the thermal dissipating device 1 is used forconducting heat released from the electronic device 2 to prevent theelectronic device 2 from operating under high temperature whichincreases unstable operating of modules and units installed in theelectronic device 2 or even damages the electronic device 2. Theelectronic device 2 is, for example, a computer capable of being placedon a desktop or a portable computer.

The electronic device 2 includes a computing module 22, a power supplyunit 24, and a displaying unit 26; the computing module 22 includes amotherboard 220 and a computing unit 222 mounted on the motherboard 220.The computing unit 222 generates dramatic quantities of heat whenoperation. The power supply unit 24 is electrically connected to thecomputing module 22 and provides the electricity 240 to the computingmodule 22 and the display unit 26.

The displaying unit 26, which displays pertinent information, iselectrically connected to the computing module 22. In addition, thedisplay unit 26 is utilized to display abnormal status of the thermaldissipating device 1, thereby allowing a user to easily understandoperation status of the thermal dissipating device 1, and thus enablingreal time elimination of possible damage, and lowing of probabilitymalfunction. The display unit 26 may receive electricity directlythrough the power supply unit 24 (as shown in FIG. 2A). The display unit26 may alternatively receive electricity directly through the computingmodule 22 that receives electricity from the power supply unit 24 (asshown in FIG. 2B). The displaying unit 26 may include a liquid crystaldisplay (LCD) panel, an organic light emitting diode (OLED) panel or aplasma display panel (PDP).

With referred again to FIG. 2A; the thermal dissipating device 1 may beinstalled into or apart from the electronic device 2. The thermaldissipating device 1 includes a thermal-cycling loop 12, a cable 13, anda controlling module 14 configured to sense a working state and controlheat dissipation efficiency of the thermal dissipating device 1. Thethermal-cycling loop 12 includes a tank 120, a pump 122, a thermalexchanger 124, and a thermal conductive unit 125. The pump 122 iscoupled to the tank 120, the thermal exchanger 124, and the thermalconductive unit 125 via a plurality of pipes 126 and utilized tocirculate a cooling liquid 129 (such as water) to cool the computingunit 222 attached to the thermal conductive unit 125. Specifically, thethermal conductive unit 125 is disposed corresponding to the computingunit 222, and the computing unit 222 is in contact with an externalsurface of the thermal conductive unit 222, such that thermal conductionis implemented between the computing unit 222 and the thermal conductiveunit 125.

The cooling liquid 129 is stored in the tank 120, and is forced to flowwithin the pipes 126 by the pump 122; the cooling liquid 129 will absorbheat generated by the computing unit 222 and thermally conducted to thethermal conductive unit 125 when flows into the thermal conductive unit125.

The thermal exchanger 124 thermally transfers heat within the coolingliquid 129 to the external environment for dispersing heat. The thermaldissipating device 1 may further include a plurality of fins 1240attached to the thermal exchanger 124; the fins 1240 may help providingadditional thermal transfer area to the thermal exchanger 124. Thethermal dissipating device 1 may still further include a fan 128 placedat the thermal exchanger 124 to provide an air flow in the thermalexchanger 124 for rapidly dissipating heat to the external environment.

With referred again to FIG. 2A; the computing module 22 and thecontrolling module 14 are electrically connected to each other by thecable 13, such that the electricity generated by the power supply unit24 can be conducted to the controlling module 14 for powering thecontrolling module 14, and signals outputted from the controlling module14 can be transmitted to the computing module 22. In this embodiment,the cable 13 may be a universal series bus (USB) cable has a USBconnector connected with a USB port of the electronic device 2.

The controlling module 14 configured to sense the working state andcontrol heat dissipation efficiency of the thermal dissipating device 1includes a microprocessor 142, a fan controller 144, a pump controller146, a cooling liquid sensor 148, and a thermal sensor 150, and themicroprocessor 142 is electrically connected to the computing module 22by the cable 13.

Please refer to both FIG. 1 and FIG. 2A along with the followingdisclosed content. The fan controller 144 is electrically connected tothe microprocessor 142 and the fan 128 and configured to control arotating speed of the fan 128 (hereafter “the fan speed”). Specifically,the fan controller 144 may generate a fan speed control signal to thefan 128 in accordance with one or more temperatures of the thermalconductive unit 125, the cooling liquid 129 (in the tank 120), and theexternal environment; the fan speed control signal is, for example, apulse width modulated signal, and the fan speed is determined accordingto changes in the duty cycle of the pulse width modulated signal.

The fan controller 144 is further configured to sense the fan speed andoutputs a fan speed abnormal signal to the microprocessor 142 when thefan speed is abnormal (such as the actual fan speed is not within therange of the normal speed). The microprocessor 142 outputs the fan speedabnormal signal to the computing module 22 via the cable 13 when itreceives the fan speed abnormal signal. The computing module 22 makesthe display unit 26 show alarm information to indicate that the fan 128is not rotating under the normal speed when it receives the fan speedabnormal signal. Therefore, user can decide whether to continually usethe electronic device 2.

The pump controller 146 is electrically connected to the microprocessor142 and the pump 122 and configured to control a rotating speed of thepump 122 (hereafter “the pump speed”), thus a flowing rate of thecooling liquid 129 is controlled. More particularly, the pump controller146 may generate a pump speed control signal to the pump 122 inaccordance with one or more temperatures of the thermal conductive unit125, the cooling liquid 129, and the external environment to change pumpspeed.

The pump controller 146 is further configured to sense the pump speedand outputs a pump speed abnormal signal to the microprocessor 142 whenthe pump speed is abnormal (such as the actual pump speed is not withinthe range of the normal speed). The microprocessor 142 outputs the pumpspeed abnormal signal to the computing module 22 via the cable 13 whenit receives the pump speed abnormal signal, and the computing module 22makes the display unit 26 show alarm information to indicate that thepump 122 is not rotated under the normal speed when it receives the pumpspeed abnormal signal. Therefore, user can decide whether to continuallyuse the electronic device 2.

The cooling liquid sensor 148 may be disposed within the tank 124 andelectrically connected to the microprocessor 142. The cooling liquidsensor 148 is configured to sense an operating temperature of thecooling liquid 129 in the tank 120 and output a liquid temperaturewarming signal to the microprocessor 142 when the temperature of thecooling liquid 129 in the tank 100 is over-heat (such as higher than asafe operation temperature (for example, 50 degrees Celsius)). Themicroprocessor 142 outputs the liquid temperature warming signal to thecomputing module 22 via the cable 13 when it receives the liquidtemperature warming signal, and the computing module 22 makes thedisplay unit 26 show warning information to indicate that the coolingliquid 129 is over-heat. Therefore, user can shut down the electronicdevice 2 or enhance thermal dissipating effect of the thermaldissipating device 1 by manually or automatically increase the fan speedand/or pump speed until the fan speed or pump speed is not within therange of the normal speed (such as reaches a maximum speed).

The cooling liquid sensor 148 may further sense a level of the coolingliquid 129 and output a level abnormal signal to the microprocessor 142when the actual level of the cooling liquid 129 in the tank 120 issensed as a low liquid level. The microprocessor 142 outputs the levelabnormal signal to the computing module 22 via the cable 13 when itreceives the level abnormal signal. The computing module 22 makes thedisplay unit 26 show alarm information to indicate that the coolingliquid 129 is at a low liquid level and the electronic device 2 will beforced to shut down and forces to shut down the electronic device 2after continually receiving the level abnormal signal for apredetermined time.

The thermal sensor 150 connected to the microprocessor 142 may be placenear to the computing unit 222 (such as attached to an internal surfaceof the thermal conductive unit 125 in contacted with the computing unit222). The thermal sensor 150 is configured to sense a workingtemperature of the computing unit 220 and will output a computing unitwarning signal to the microprocessor 142 when the working temperature ofthe computing unit 222 is in over-heat status (i.e., the workingtemperature is not in a range retaining the thermal stability and lifeof the computing unit 222). The microprocessor 142 outputs the warmingsignal to the computing module 22 via the cable 13 when it receives thecomputing unit warning signal. The computing module 22 makes the displayunit 26 show warning information to indicate that the computing unit 222is in the over-heat status. Therefore, user may shut down the electronicdevice 2 or enhance thermal dissipating effect of the thermaldissipating device 1 by manually or automatically increase the fan speedand/or pump speed; the display unit 26 will stop showing the warninginformation mentioned above if the working temperature decreases to bein the range retaining the thermal stability and life of the computingunit 222.

Reference is made to FIG. 3, which is a flowchart showing steps forbooting an electronic device according to the present disclosure. Atfirst, the power supply unit 24 of the electronic device 2 implementsprocedure of electricity correction when the user presses a button forbooting an electronic device 2 having the thermal dissipating device 1.In step S302, a correction is made as to whether the power supply unit24 is unusual. When the power supply unit 24 is usual, the electricityis generated and transmitted to the computing module 22 (and the displayunit 26) to implement booting procedure of the electronic device 2 (stepS304), and when the power supply unit 24 is unusual, the bootingprocedure is stopped implementing and the electricity is interrupted(step S303). In particularly, the booting procedure of the electronicdevice 2 is the same as that of in currently and is not repeated here.

Reference is made to FIG. 4, which is a flowchart showing steps forthermal dissipating method of the thermal dissipating device accordingto the present disclosure. When the booting procedure of the electronicdevice 2 (step S304) is completely implemented, a self-conditioninspecting procedure (step S308) is then implemented. The purpose of theself-condition inspecting procedure is made to whether thethermal-cycling loop 12 is unusual, namely, to whether the pump 122, thefan 128 and the cooling liquid 129 is unusual to prevent the thermaldissipating device 1 from breakdown.

After implementing the self-condition inspection, a cooling monitoringprocedure is then implemented. The cooling monitoring procedureincludes: at first, the controlling module 14 senses whether theoperating temperature of the cooling liquid 129 in the tank 120 isover-heat via the cooling liquid sensor 128 (step S312), and thecontrolling module 14 senses whether the working temperature of thecomputing unit 222 is over-heat (step S314).

After step S312, when the temperature of the cooling liquid 129 is notover-heat, the rotating speeds of the fan 128 and the pump 122 aremaintained (step S316), and then back to step S312 to implement coolingmonitoring procedure. After step S314, when the working temperature ofthe computing unit 222 is not overheat, the rotating speeds of the fan128 and the pump 122 is maintained (step S316), and back to step S314 toimplement cooling monitoring procedure.

After step S312, when the temperature of the cooling liquid 129 isover-heat, and after step S314, when the working temperature of thecomputing unit 222 is over-heat, the cooling liquid sensor 148 senseswhether the level of the cooling liquid 129 is in a low liquid level(step S326).

After step S326, when the level of the cooling liquid 129 is as a lowliquid level, a level abnormal signal is generated by the cooling liquidsensor 148 and transmitted to computing module 22. The computing module22 makes the displaying unit 26 show alarm information to indicate thatthe cooling liquid 129 is at a low liquid level and the electronicdevice 2 will be forced to shut down (step S321). The computing module22 further forces to shut down the electronic device 2 after continuallyreceiving the level abnormal for a predetermined time (such as 30seconds) (step S322). After step S326, when the cooling liquid 129 isnot as a low liquid level, a liquid temperature warming signal isgenerated by the cooling liquid sensor 145. The liquid temperaturewarming signal is transmitted to the computing module 22 and thecomputing module 22 makes the displaying unit 26 show warninginformation to indicate that the cooling liquid 129 is over-heat (stepS318) and goes through the step S320.

In step S320, the fan controller 144 senses whether the rotating speedof the fan 128 is within a range of the normal speed (such as 2400 RPM),and the pump controller 146 senses whether the rotating speed of thepump 122 is within a range of the normal speed (such as 4500 rpm).

After step S320, when the rotating speed of the fan 128 exceeds therange of the normal speed, a fan speed abnormal signal generated by thefan controller 144 is transmitted to the computing module 22, and thenthe computing module 22 makes the displaying unit 26 show the alarminformation to indicated that the fan 128 is not within a range of thenormal speed and the electronic device 2 will be forced to shut down(step S321), and forces to shut down the electronic device 2 aftercontinually receiving the fan speed abnormal signal for a predeterminedtime (step S322).

After step S320, when the rotating speed of the pump 122 exceeds therange of the normal speed, a pump speed abnormal signal generated by thepump controller 146 is transmitted to the computing module 22. Thecomputing module 22 makes the displaying unit 26 show the alarminformation to indicated that the pump 122 is not within a range of thenormal speed and the electronic device 2 will be forced to shut down(step S321), and forces to shut down the electronic device 2 aftercontinually receiving the pump speed abnormal signal for a predeterminedtime (step S322). After step S320, when the rotating speed of the fan128 and the pump 122 are within the range of the normal speed, user canselect whether to manual control the thermal dissipating device 1 (stepS323).

When user selects to manual control to thermal dissipating device 1,controlling commands can be inputted by the electronic device 2 toincrease rotating speeds of the fan 128 and/or the pump 122 (step S324),such that the thermal dissipating ability of the thermal dissipatingdevice 1 can be enhanced. After that, back to the step S312 and stepS314 to implement cooling monitoring procedure.

After step S323, when user does not select to manual control the thermaldissipating device 1, the microprocessor 142 automatic regulates therotating speeds of the fan 128 or/and the pump 122 according to theoperating temperatures of the cooling liquid 129 and the workingtemperature of the computing unit 222 (step S325) to enhance thermaldissipating ability of the thermal dissipating device 1. After that,back to step S312 and step S314 to implement cooling monitoringprocedure.

Reference is made to FIG. 5, which is a flowchart showing steps for aself-condition inspection according to the present disclosure. Theself-condition inspection of step S308 includes steps shown in FIG. 4.At first, the fan controller 144 senses whether a rotating speed of thefan 128 is unusual (step S3080), and the pump controller 146 senseswhether a rotating speed of the pump 122 is unusual (step S3082).

When the rotating speed of the fan 128 sensed by the fan controller 144is unusual, a fan speed abnormal signal is outputted from the fancontroller 144 and transmitted to the microprocessor 142 (step S3084).The fan speed abnormal signal includes an unusual information of the fan128 and current rotating speed of the fan 128. The fan speed abnormalsignal is transmitted to the computing module 22 via the cable 13 by themicroprocessor 142, and may be shown on the displaying unit 26. When therotating speed of the fan 128 sensed by the fan controller 144 is usual,the rotating speed of the fan 128 is maintained (step S3083).

After step S3082, when the rotating speed of the pump 122 sensed by thepump controller 146 is unusual, a pump speed abnormal signal isoutputted from the pump controller 146 and transmitted to themicroprocessor 142 (step S3084). The pump speed abnormal signal includesan unusual information of the pump 122 and current rotating speed of thepump 122. The pump speed abnormal signal is transmitted to the computingmodule 22 via the cable 13 by the microprocessor 142, and may be shownon the displaying unit 26 controlled by the computing module 22. Whenthe rotating speed of the pump 122 sensed by the pump controller 146 isusual, and the rotating speed of the pump 122 is maintained (stepS3083).

In the present disclosure, the cable 13 includes the USB connector, suchthat a function of plug and play is provided, and is convenient to use.Moreover, the self-condition inspecting procedure of the thermaldissipating method is prior implement after the electronic device 2implementing the booting procedure and electricity correcting procedure,such that the damage of the electronic device 2 causes by unusualthermal dissipating device 1 is prevented. Furthermore, the coolingmonitoring procedure is implemented after the booting procedure of theelectronic device 2 is finished, warning the user when the operatingtemperature of the computing unit 222 and the cooling liquid 129 isover-heat, and forcing to shut down the electronic device 2 when therotating speeds of the fan 128 and the pump 122 exceed the ranges of thenormal speeds respectively, such that the safety of usage is enhanced.

Although the present disclosure has been described with reference to theforegoing preferred embodiment, it will be understood that thedisclosure is not limited to the details thereof. Various equivalentvariations and modifications can still occur to those skilled in thisart in view of the teachings of the present disclosure. Thus, all suchvariations and equivalent modifications are also embraced within thescope of the disclosure as defined in the appended claims.

What is claimed is:
 1. A water-cooling thermal dissipating system,comprising: an electronic device, comprising: a computing modulecomprising a computing unit releasing heat; a power supply unitelectrically connected to the computing module and configured to supplyan electricity to the computing module; and a display unit electricallyconnected to the computing module; a thermal dissipating device,comprising: a thermal conductive unit disposed corresponding to thecomputing unit, wherein the computing unit is attached to an externalsurface of the thermal conductive unit for thermal conduction; a pumpcoupled to the thermal conductive unit for pumping a cooling-liquid intothe thermal conductive unit; a tank coupled to the pump, wherein thecooling-liquid is stored in the tank; a thermal exchanger coupled to thethermal conductive unit and the tank, wherein the cooling liquid isallowed to flow into the thermal conductive unit for absorbing heatproduced by the computing unit, and the thermal exchanger then thermallytransfers heat within the cooling liquid to an environment external tothe thermal exchanger for dispersing heat; a controlling moduleconfigured to sense a working state and control heat dissipationefficiency of the thermal dissipating device; a cable connected to thecomputing module and the controlling module, wherein the computingmodule and the controlling module are electrically connected to eachother through the cable so that the electricity generated by the powersupply unit is conducted to the controlling module for powering thecontrolling module; a first pipe directly connected between the thermalconductive unit and the thermal exchanger; a second pipe directlyconnected between the thermal exchanger and the tank; a third pipedirectly connected between the tank and the pump; and a fourth pipedirectly connected between the pump and the thermal conductive unit,wherein the pump is configured to force the cooling liquid to flowwithin the first pipe, the second pipe, the third pipe and the fourthpipe; wherein an abnormal signal is generated and sent to the computingmodule through the cable by the controlling module when the thermaldissipating device is sensed to be in an abnormal state by thecontrolling module, and the computing module then makes the display unitshow alarm information and forces to shut down the electronic deviceafter continually receiving the abnormal signal for a predeterminedtime.
 2. The water-cooling thermal dissipating system in claim 1,wherein the abnormal signal is generated when a pump speed is not withina range of a normal speed.
 3. The water-cooling thermal dissipatingsystem in claim 1, wherein the abnormal signal is generated when a levelof the cooling liquid is sensed as a low liquid level.
 4. Thewater-cooling thermal dissipating system in claim 1, wherein thecontrolling module further generates a warning signal when an operatingtemperature of the cooling liquid is over-heat.
 5. The water-coolingthermal dissipating system in claim 1, wherein the controlling modulefurther generates a warning signal when a working temperature of thecomputing unit is over-heat.
 6. The water-cooling thermal dissipatingsystem in claim 5, wherein the computing module makes the display unitshow warning information when the computing module receives the warningsignal.
 7. The water-cooling thermal dissipating system in claim 1,wherein the thermal dissipating device further comprises a fan placed atthe thermal exchanger to provide an air flow in the thermal exchangerfor rapidly dissipating heat to the environment external to the thermalexchanger.
 8. The water-cooling thermal dissipating system in claim 7,wherein the abnormal signal is generated when a fan speed is not withina range of another normal speed.
 9. The water-cooling thermaldissipating system in claim 7, wherein the controlling modulecomprising: a microprocessor electrically connected to the computingmodule through the cable; a fan controller electrically connected to themicroprocessor and the fan, wherein the fan controller is configured tocontrol and sense the fan speed; a pump controller electricallyconnected to the microprocessor and the pump, wherein the pumpcontroller is configured to control and sense pump speed; a coolingliquid sensor disposed within the tank and electrically connected to themicroprocessor for sensing an operating temperature of the coolingliquid; and a thermal sensor disposed near the thermal conductive unitand electrically connected to the microprocessor, wherein the thermalconductor for sensing a working temperature of the thermal conductiveunit.
 10. The water-cooling thermal dissipating system in claim 9,wherein the thermal sensor is attached to an internal surface of thethermal conductive unit in contact with the computing unit.
 11. Thewater-cooling thermal dissipating system in claim 1, wherein the powersupply further supplies the electricity to the display unit directly.12. The water-cooling thermal dissipating system in claim 1, wherein thepower supply unit further supplies the electricity to the display unitthrough the computing module.
 13. The water-cooling thermal dissipatingsystem in claim 1, wherein the cable is a universal series bus (USB)cable having a USB connector connected with a USB port of the electronicdevice.